Molex Introduces First Hybrid Optical Connector Interconnect for Co-Packaged Optical Assemblies (CPOs)

Molex announces the first pluggable module solution for co-packaged optical assemblies (CPOs). The new External Laser Source Interconnect System (ELSIS) is a complete system with enclosures, optical and electrical connectors, and pluggable modules th...

STMicroelectronics releases two flexible and versatile power modules to simplify SiC inverter design

STMicroelectronics has announced two STPOWER power modules with built-in 1200V silicon carbide (SiC) MOSFETs in mainstream configurations. Both modules utilize ST's ACEPACK 2 packaging technology for high power density and easy installation.

Ruggedized AC filter capacitors certified to the highest safety levels

TDK's B32354S* series of AC filter capacitors adds to its portfolio of EPCOS metalized polypropylene film (MKP) capacitors for AC filter applications. The capacitors are available in a 4-pin design with 52.5 mm pin spacing, rated at 275 VAC or 350 VA...

UVC light-emitting diodes with ceramic/quartz substrates

Vishay introduces two ceramic/quartz-substrate UVC (short-wave ultraviolet) light-emitting diodes, the VLMU35CR40-275-120 and the VLMU35CR41-275-120, for sterilizing medical, industrial, and consumer electronics applications.

Turck introduces ultrasonic sensors

Turck's RU-U series of ultrasonic sensors enables customers to cover a larger detection range with fewer models. the M18 and M30 series products have larger detection distances, which makes inventory management more efficient. This is mainly due to t...