Molex Introduces First Hybrid Optical Connector Interconnect for Co-Packaged Optical Assemblies (CPOs)

Molex announces the first pluggable module solution for co-packaged optical assemblies (CPOs). The new External Laser Source Interconnect System (ELSIS) is a complete system with enclosures, optical and electrical connectors, and pluggable modules that uses proven technology to accelerate hyperscale data center development.

Molex is trialling the ELSIS hybrid opto-electronic connector and box system, enabling engineers to develop and test far ahead of current CPO industry applications. Accompanying design and development data for the pluggable module system is now available, including 3D models, technical drawings and detailed specifications.Molex aims to have a fully integrated solution available in the third quarter of 2023, enabling companies to commercialize their designs and rapidly ramp up volumes as CPO acceptance grows.

• ELSIS is a complete solution for next-generation co-packaged optical assemblies (CPOs) that require an external laser source
• Addresses I/O challenges in criticality safety, thermal management and field replacement or upgrade in the face of demanding hyperscale data centers
• Samples of Blind-Plug Hybrid Optical Connectors Now Available and Will Be Showcased at ECOC 2022

Addressing the Challenges of Security, Thermal Management and Signal Integrity

CPO, a next-generation technology that moves the optical connection from the front panel to inside the host system, in close proximity to high-speed ICs, "From high-speed networking chips to graphics processing units (GPUs) and AI engines, the need for I/O bandwidth continues to escalate," said Tom Marrapode, director of advanced technology development for Molex Optical Solutions. By placing optical components closer to these ASICs, CPOs will be able to address the complex issues associated with high-speed electrical traces, including signal integrity, density and power consumption."

Traditional pluggable modules have optical connections located on the user side of the module, raising eye safety concerns when used with high-power laser sources such as CPOs.ELSIS, a blind plug-and-play solution that eliminates the need for users to touch fiber ports and cables, provides a complete external laser source system with features such as safety and ease of implementation and maintenance.

Using an external laser source also means removing a major heat source from the optoelectronics and IC package. In addition, the design eliminates high-speed electrical I/O drivers on ICs and pluggable modules, further reducing thermal loads and power consumption inside the device.

Accelerating the design process with proven solutions

Molex uses its existing optical and electrical I/O products, which have shipped millions of ports over the past 20 years, as building blocks for ELSIS, proving field reliability. This ensures known field performance and reduces the need for extensive engineering and testing. In contrast, competitors' proposed CPO solutions will utilize completely new designs that are subject to extensive validation and will expose time-to-market to uncertainty.

ELSIS also offers unique advantages as a fully integrated solution. The external laser source system contains a complex combination of optical and electrical connectors, pluggable modules, an internal host system, fiber optic cables and enclosures. Because all of these components are designed in-house, Molex was able to create a complete, fully engineered system, eliminating the lengthy design cycle required to integrate these components. The end result is a highly interoperable, high-performance system that delivers a plug-and-play experience for designers and end users. 

This is made possible by Molex's extensive product portfolio, including optical and electrical connectors, on-card fiber optic cables, optoelectronic modules and enclosure designs. As the only company that can integrate these capabilities in-house, Molex is leading the industry's transition to CPO.

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