Excelitas Technologies Introduces Enhanced CIPRM Series Balanced Receivers

Excelitas Technologies recently introduced an enhanced CIPRM-coherent InGaAs PIN balanced receiver module. The upgraded CIPRM incorporates two low-noise photodiodes with closely matched responsivity to ensure a high common-mode rejection ratio (CMRR)...

Smiths Interconnect launches Kepler scratch test socket for high-speed transmission and high-frequency testing

The spring probe scratching type Kepler test socket can be applied to LGA, QFN, QFP packaged chips with a minimum pitch of 0.65mm for high-speed transmission and high-frequency testing.

Infineon Introduces TLE988x and TLE989x Series of MOTIX MCU Embedded Power ICs

Infineon further expands its comprehensive and proven MOTIX™ MCU embedded power IC portfolio with the introduction of the TLE988x and TLE989x series. Infineon's system-on-chip solutions integrate gate drivers, microcontrollers, communication interf...

Molex Introduces First Hybrid Optical Connector Interconnect for Co-Packaged Optical Assemblies (CPOs)

Molex announces the first pluggable module solution for co-packaged optical assemblies (CPOs). The new External Laser Source Interconnect System (ELSIS) is a complete system with enclosures, optical and electrical connectors, and pluggable modules th...

STMicroelectronics releases two flexible and versatile power modules to simplify SiC inverter design

STMicroelectronics has announced two STPOWER power modules with built-in 1200V silicon carbide (SiC) MOSFETs in mainstream configurations. Both modules utilize ST's ACEPACK 2 packaging technology for high power density and easy installation.