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Smiths Interconnect launches Kepler scratch test socket for high-speed transmission and high-frequency testing

2023-08-24 14:07:41

The spring probe scratching type Kepler test socket can be applied to LGA, QFN, QFP packaged chips with a minimum pitch of 0.65mm for high-speed transmission and high-frequency testing.

Whether it is used in high-performance computing, wearable devices or other automotive chip testing, the Kepler test socket is the only test solution on the market that can provide two-way motion during a single test movement of the probe. This innovative structural design makes Kepler The test socket effectively improves the pass rate of the first test of chips packaged in LGA, QFN, and QFP, increases the reliability of chip testing, and prolongs the maintenance cycle of the test socket.

The semiconductor testing industry traditionally uses vertical spring probes to test LGA, QFN and QFP packages, and the cantilever scratch needle design is used for QFN and QFP package testing to remove surface oxides and contaminants. However, both technologies have their own drawbacks and require frequent maintenance and performance monitoring to ensure optimal results during the testing cycle.

Typically, the surface of each chip's pins is covered with a very thin layer of glass-like material called an oxide. During testing, in order to get a good contact with the chip pins, the test needle must break through this thin layer of oxide to obtain better signal transmission. In order to solve these problems, Smiths Intercom specially developed the Kepler scratch test socket for LGA, QFN, QFP packages. The horizontal movement generated during the downward movement of the needle will scratch the surface of the chip and destroy the surface oxide, so that the chip pin and the probe needle can obtain stable and reliable contact without causing damage to the PCB.

Brian Mitchell, vice president and general manager of Smiths Interconnect Semiconductor Test Division, said: "Continuing advances in semiconductor functionality, density, and chip-level integration have created new challenges for testing and controlling the physical and electrical characteristics of the test contact interface. Due to The accumulation of oxides on the surface has always been a challenge to obtain a good contact between the test pin and the chip pin. Smith Intercon’s Kepler test socket overcomes the challenges brought about by the traditional vertical spring probe and cantilever scratch pin design, Its innovative structural design helps the probes to make good electrical contact with the surface of the chip pins, which improves the reliability of LGA, QFN, and QFP chip testing to a new level."

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