AI and HPC Demand Driven, Demand for HBM Capacity Estimated to Increase Nearly 60% Annually by 2023

AI and HPC Demand Driven, Demand for HBM Capacity Estimated to Increase Nearly 60% Annually by 2023

Infineon Announces €5 Billion Investment to Expand Silicon Carbide Capacity

The counter-trend growth of semiconductor segments such as AI chips and silicon carbide has given the industry more confidence. In the global semiconductor industry downturn cycle, Infineon, Intel is still hibernating and expanding production to stor...

Littelfuse Introduces Micro-D Connector Series Featuring Removable Crimp Contacts Used in the Aerospace Industry

Littelfuse introduces its latest C&K product. MDMA Micro-D connectors with removable crimp contacts. This unique design innovation allows end users to easily create customized cable harnesses, a feature not available on any other Micro-D connector on...

Infineon further expands MOSFET device portfolio with advanced OptiMOS™ power MOSFETs

Small discrete power MOSFETs play a critical role in saving space, reducing cost and simplifying application design

Small package motor driver IC with fewer external parts saves board space

Toshiba Electronic Components and Memory Devices Corporation today announced the release of the motor driver ICs "TB67S581FNG," "TB67S580FNG," "TB67H481FNG," and "TB67H480FNG," which not only require a reduced number of external parts, but also utili...