Lantron Electronic Logo
Title

News Category

Electronic components related news

  • Lantech Pilot Produces DDR5 3rd Sub-Generation RCD Chip

    Lancel Technology announced that its third generation products are ready for trial production,continues to refine its DDR5 memory interface technology and advance product upgrades and iterations.

    2023-10-30
  • Indian firm Reliance Industries is in talks to buy Israel's Thal Semiconductor

    Indian firm Reliance Industries is in talks to buy Israel's Thal Semiconductor,if successful, would provide the group with an entry into the semiconductor sector and could accelerate India's ambitions to set up a fab in the country.

    2023-10-26
  • what are the differences between AI chips and traditional chips?

    AI chips are specifically designed to accelerate artificial intelligence tasks such as machine learning and deep learning,whereas traditional chips are universally designed to perform a variety of common tasks like computation, storage and communic...

    2023-10-25
  • What are the differences between the active and passive components?

    What are the differences between the active and passive components?The active and passive components are two basic classifications of electronic components...

    2023-10-24
  • How to package electronic components?

    Choosing the right packaging method for components has become an important part of the shipping process.So let's see what is the best packaging method for your electronic components.

    2023-10-23