Lantech Pilot Produces DDR5 3rd Sub-Generation RCD Chip

On October 27-28, 2021, as an eco-partner of Intel Corporation for many years, Lancel Technology was invited to participate in Intel Innovation and set up a virtual booth on Intel's official website to demonstrate its DDR5 first generation memory interface and module supporting chips and their application scenarios to the industry in the form of videos, pictures and promotional colorful pages. After 2 years, Lancel Technologys announced that its third generation products are ready for trial production.

In addition to RCD chips, they also provides memory interface and module supporting chips such as DDR5 Data Buffer (DB), Serial Detection Hub (SPD Hub), Temperature Sensor (TS), Power Management IC (PMIC), etc. These chips are also part of the DDR5 memory interface and module supporting chips. These chips are also important components of DDR5 memory modules and can be used in conjunction with the RCD chips to provide a variety of essential functions and features for DDR5 memory modules.

As a leading international supplier of memory interface chips, Lancel  continues to refine its DDR5 memory interface technology and advance product upgrades and iterations. The company's new DDR5 RCD03 chip supports data rates up to 6400 MT/s, a 14.3% increase compared to the second generation and a 33.3% increase compared to the first generation.

Compared to the DDR4 generation of RCD products, the chip utilizes a dual-channel architecture to support higher storage efficiency and lower access latency; adopts 1.1V VDD and 1.0V VDDIO voltages and a variety of power-saving modes to significantly reduce power consumption; and supports higher-density DRAM with a maximum capacity of up to 256GB in a single module.

Mr. Stephen Tai, President of Lancel Technologys Technology, said, "We are honored to be the industry leader in both R&D and pilot production of the DDR5 RCD03 chip. Lancel Technologys will continue to work closely with international mainstream CPU and DRAM vendors to help commercialize DDR5 servers on a large scale."

Dr. Dimitrios Ziakas, Vice President of Memory and IO Technology at Intel, said, "Intel has been at the forefront of the development of the DDR5 memory technology and ecosystem, supporting reliable and scalable industry standards. We are pleased to see Lancel Technologys make new advances in the latest generation of DDR5 memory interface chips that work with Intel's next generation of E-core and P-core Xeon® CPUs to help them unleash powerful performance."

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