Molex Quad-Row Board-to-Board Connectors Set New Standard for Space-Optimized Connectivity

Molex's Quad Row Board-to-Board Connectors. These connectors feature a staggered circuit layout and a patented 0.175mm pitch low-profile design that saves 30% space compared to conventional connectors. They give product developers and device manufacturers more freedom and flexibility to support compact form factors and are ideal for augmented reality/virtual reality (AR/VR), automotive, communications, IoT, medical and wearable applications.

Molex Quad Row Board-to-Board Connectors are rated at 3.0A and capable of transmitting high power in a compact form factor. Additionally, the product adheres to a standard 0.35mm solder pitch, which speeds up volume production using typical surface mount technology (SMT) processes. Relying on the device's internal armor and insert-molded nail design prevents pin damage during mass production and assembly, ensuring these connectors have consistent, reliable performance. These features, combined with a wide alignment space, contribute to a secure, easy mating with reduced dropout rates.

"Molex continues to drive innovation in connectivity, bringing engineers smaller, higher-performance devices," said Justin Kerr, vice president and general manager of Molex's Micro Solutions business unit. With devices, customers can squeeze more sensors and functions into smaller and smaller device spaces without compromising device performance. In doing so, Molex will set a new standard for space-optimized connectivity."

Molex Quad Row Board-to-Board Connectors are available now in 32- and 36-pin versions, with 20- and 64-pin versions coming soon. In addition, Molex also plans to make this product support up to 100 pins. Suitable applications for these devices include smartphones, wearables, IoT and smart home devices, AR/VR devices, drones, patient monitoring systems, therapeutic and surgical equipment, and more.

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