Global semiconductor capacity to reach 30 million pieces per month in 2024
SEMI pointed out that the global semiconductor capacity in 2024 will achieve a breakthrough increase, stemming from multiple reasons such as the increase in leading-edge logic and foundry capacity, applications such as generative artificial intelligence and high-performance computing (HPC), as well as the recovery of the chip's final demand.
"Recovering global market demand and strengthening government incentives are driving a surge in fab investment in major chip manufacturing regions, with global capacity expected to grow by 6.4 percent in 2024," said Ajit Manocha, president and CEO of SEMI. "The heightened global focus on the strategic importance of semiconductor manufacturing for national and economic security is a key catalyst for these trends."
The report shows that from 2022 to 2024, the global semiconductor industry plans to start operations of 82 new fabs, including 11 projects in 2023 and 42 in 2024, with wafer sizes ranging from 300mm to 100mm (12-inch to 4-inch).
Geographically, China leads the semiconductor industry expansion. Driven by government funding and other incentives, China's share of global semiconductor production is expected to increase. Mainland Chinese semiconductor manufacturers' 2023 production capacity grew 12% year-on-year to 7.6 million wafers per month. Mainland Chinese chipmakers are expected to start operating 18 projects in 2024, with capacity increasing 13% year-on-year in 2024 to 8.6 million wafers per month.
Taiwan, China will remain the second largest semiconductor production capacity, 2023 capacity will grow 5.6% to 5.4 million wafers per month, 2024 growth of 4.2% to 5.7 million wafers per month, 2024 will be the establishment of five new fabs.
South Korea's chip capacity in 2023 to 4.9 million wafers per month third, 2024 will grow to 5.1 million wafers per month. Japan's capacity is expected to reach 4.7 million wafers in 2024.
The Americas will have six new fabs by 2024, with chip capacity growing 6% year-over-year to 3.1 million wafers per. Europe and the Middle East are expected to add 3.6% capacity in 2024 to 2.7 million wafers per month. Southeast Asia is expected to see a 4% increase in capacity to 1.7 million wafers per by 2024 as four new fab projects are launched.
From the product area, due to weak demand for consumer electronics such as personal computers and smartphones, capacity expansion in the field of memory chips slowed in 2023, with monthly capacity increasing by only 2% in 2023 to 3.8 million wafers per month, and increasing by 5% in 2024 to 4 million wafers per month. 3D NAND installed capacity is expected to be flat in 2023 at 3.6 million wafers per month, and 3D NAND installed capacity is expected to remain flat at 3.6 million wafers per month in 2023 and increase by 2% to 3.7 million wafers per month in 2024.
As for discrete components and analog chips, vehicle electrification remains a key driver for capacity expansion. The discrete component chip capacity is expected to grow 10% in 2023 to 4.1 million wafers per month, 2024 will continue to grow 7% to 4.4 million wafers per month. Analog chip capacity is expected to grow 11% in 2023 to 2.1 million wafers and 10% in 2024 to 2.4 million wafers.
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