SK Hynix Announces Mass Production of World's Highest 238-Layer 4D NAND Flash Memory
SK hynix announced that it has started mass production of 238-layer 4D NAND flash memory and is conducting product verification with overseas customer companies that produce smartphones. Previously, the company successfully developed the world's highest 238-layer NAND flash memory in August last year
SK hynix emphasized: "Based on 238-layer NAND flash memory, the company has successfully developed client SSD (Client SSD) solution products suitable for smartphones and PCs, and has started mass production in May. The 238-layer products have ensured the world's top competitiveness in terms of cost, performance and quality, and it is expected that these products will play a leading role in improving the company's performance in the second half of the year."
As the smallest chip in the world, the 238-layer NAND flash memory has a production efficiency that is 34% higher than the previous generation's 176-layer chip, and its cost competitiveness has been greatly improved. The data transfer speed of this product is 2.4Gb (gigabit) per second, which is 50% faster than the previous generation. And it has also improved the read and write performance by about 20%, so the company is confident that it will provide higher performance for smartphone and PC customers who adopt this product.
SK hynix plans to supply 238-layer NAND flash memory to mobile products first after completing verification by smartphone customer companies, and then expand its application to PCIe 5.0*-based PC solid-state drives (SSDs) and data center-class high-capacity solid-state drives. Hard disk products, etc.
*PCIe 5.0: PCIe (Peripheral Component Interconnect Express) is an interface specification of a serial structure developed for high-speed input and output data. PCIe 5.0 can provide twice the bandwidth of PCIe 4.0 (32GT/s, gigabit transmission/second).
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