Molex Introduces First Chip-to-Chip Portfolio of 224G Connectors to Accelerate Support for Next-Gen Data Center and Generative AI Applications

Global Electronics Leader and Connectivity Innovator Molex Introduces Industry’s First Chip-to-Chip 224G Portfolio, Including Next-Generation Cable, Backplane, Board-to-Board Connector and Near-ASIC Connector-to-Cable Solutions Next to ASICs solution, transmission speed up to 224 Gbps-PAM4. Molex is therefore uniquely positioned to meet the industry's higher demand for the fastest available data rates, which in turn meet the growing demand for generative AI, machine learning (ML), 1.6T networking and other high-speed application systems.

"Molex is working closely with major technology innovators, as well as key data center and enterprise customers, to prepare for the launch of 224G products," said Jairo Guerrero, vice president and general manager, Molex Copper Solutions, Molex. approach that helps us engage stakeholders in the 224G ecosystem early on to identify and resolve potential performance bottlenecks and design challenges, from signal integrity to EMI reduction to more effective thermal management Requirements in all aspects."

Innovations in connectivity fuel the development of the 224G ecosystem

Achieving data rates up to 224 Gbps-PAM4 requires new system architectures for multiple chip-to-chip connections, an important and complex technology inflection point. To this end, a cross-functional global team of Molex engineers works closely with customers, technology leaders and suppliers to accelerate the design and development of complete, best-in-class connectivity solutions using the latest predictive analytics and advanced software simulation methods , which includes：

• Mirror Mezz Enhanced - A new addition to the Mirror Mezz™ family of intermediate board-to-board connectors with no male/female termination, the Mirror Mezz Enhanced connectors connect 224 Gbps-PAM4 rate circuits while meeting varying connection heights, overcoming PCB space constraints as well as manufacturing and assembly challenges, thereby lowering It overcomes PCB space constraints as well as manufacturing and assembly challenges to reduce application costs and time-to-market.

• The Mirror Mezz Enhanced connector extends the functionality of Mirror Mezz and Mirror Mezz Pro, which was selected by the Open Accelerator Infrastructure Group of the Open Compute Project (OCP) as an Open Control Module (OCM) standard. OCM) standard. This reinforces Molex's overall commitment to working with industry leaders to support the explosive growth of AI and other gas pedal infrastructure systems.

• Inception™ Backplane Connectors - Molex's first backplane connection system designed from a cable-first perspective that does not differentiate between male and female mating terminals, providing greater application flexibility from the outset with variable terminal spacing (density), optimal signal integrity, and simplified integration with multiple system architectures. The introduction of simplified SMT technology reduces the need for complex drilling of holes in the printed circuit board and through-hole processing at the PCB interface.Molex offers several wire gauge options that allow you to select the right gauge to match the custom cable lengths inside and outside the application to optimize channel performance.

• CX2 Dual Speed Connectors - Molex's 224 Gbps-PAM4 near-ASIC connectors provide a robust and reliable connection to the cable system, with the benefits of post-mating screw locking, integrated strain relief, reliable mechanical friction travel, and a fully protected "thumbtack-proof" mating interface. The benefits of the integrated post-pair screw locking feature, reliable mechanical friction travel and fully protected "thumb-touch proof" mating interface ensure a reliable connection over the long term. High-performance dual coaxial cables and innovative shielding provide excellent isolation from Tx/Rx circuits.

• OSFP 1600 Solutions - These I/O products include SMT connectors and cages, BiPass, as well as direct-attach cable (DAC) and active cable (AEC) solutions to achieve 224 Gbps-PAM4 per channel or 1.6T per connector in aggregate. Improved shielding minimizes crosstalk while increasing signal integrity at higher Nyquist frequencies. These state-of-the-art connector and cable solutions are designed for improved mechanical robustness and durability.

• QSFP 800 and QSFP-DD 1600 Solutions - This family has also been upgraded to offer SMT connectors and cages, Bipass, as well as Direct Attached Cable (DAC) and Active Cable (AEC) solutions that can achieve total connection speeds of up to 224 Gbps-PAM4 per channel or 1.6T per connector. Molex's QSFP and QSFP-DD solutions ensure mechanical robustness, improve signal integrity, reduce thermal loads, increase design flexibility and lower rack costs.

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