Infineon introduces new current-rated module. 1200 V 62 mm IGBT7
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces a portfolio of 62 mm half-bridge and common-emitter modules equipped with the 1200 V TRENCHSTOP™ IGBT7 chip. With a maximum current specification of up to 800 A, the modules extend Infineon's product portfolio in the proven 62 mm package design. The increased current output capability offers system designers not only maximum flexibility when designing solutions with higher current ratings, but also higher power density and better electrical performance. The new module has been developed specifically to meet the needs of centralized solar inverters as well as industrial motor drives and uninterruptible power supplies (UPS). In addition, it is widely applicable to electric vehicle charging piles, energy storage systems (ESS) and other new industrial applications.
Based on the new microtrench technology, the static losses of the 62 mm module series with 1200 V TRENCHSTOP IGBT7 chips are significantly lower than those of the modules with IGBT4 chipsets. These characteristics significantly reduce losses in applications, especially in industrial motor drives operating at medium switching frequencies, and the oscillatory behavior and controllability of the IGBTs have also been improved. In addition, the new power modules have a maximum overload junction temperature of 175°C. The robust nickel-plated copper chassis is also available.
A robust nickel-plated copper backplane and nutted main terminals ensure the mechanical strength of the 62 mm module package. The main terminals are located in the center of the package and are ideally suited for parallel circuits and three-level topology configurations due to their low DC link connection inductance. The standard package design and dimensions make the series compatible with previous module versions. In addition, all modules are available with Infineon's proven pre-coated thermal interface material (TIM).
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