Silicon Labs Introduces New 2.4 GHz Wireless PCB Module
Silicon Labs' new BGM240P and MGM240P PCB modules. The modules are designed to provide faster time-to-market for connected products for smart home and industrial applications; and, as an extension to the BG24 and MG24 family of wireless SoCs, these new modules support developers in achieving reliable wireless performance, energy efficiency, and protection from cyber attacks.
The new BGM240P and MGM240P PCB modules are designed to deliver industry-leading RF performance, low power consumption and extensive regulatory approvals, so developers can get devices to market faster. Designed for developers without extensive RF experience, these certified modules offer many of the same benefits as their SoC counterparts, including a Cortex M33 processor with 1.5 MB of Flash and 256 kB of RAM, as well as PSA Level 3 security certification. Here are other key features of these modules:
- BGM240P supports low-power Bluetooth 5.3 and Bluetooth Mesh connectivity
- MGM240P supports multi-protocol connectivity (802.15.4, Matter, and low-power Bluetooth 5.3)
- Built-in antenna or RF pins
- +10 or +20 dBm TX output power
- Industry-leading Rx RF performance
- 32-bit ARM® Cortex®-M33 core at 39 MHz
- Rich set of analog and digital peripherals
With proven RF performance, the new BGM240P and MGM240P modules have passed demanding wireless regulatory certifications such as FCC, CE, IC/ISED, MIC/TELEC, and KCC, so designers can achieve fast time-to-market by simplifying complex RF design and testing. These modules enable designers to avoid lengthy development and certification cycles, and provide support for a wide range of 2.4 GHz wireless IoT protocols, including low-power Bluetooth and Bluetooth Mesh, as well as Zigbee, OpenThread, Matter, and multi-protocol.
Security is a core feature of these PCB modules, which include PSA Level 3 certified Secure VaultTM and provide a dedicated security engine with advanced security features, including advanced, DPA countermeasure hardware encryption for security algorithms such as AES128/256, Secure Boot with Root of Trust and Secure Loader (RTSL) technology, tamper detection, and Secure key management with Physical Unclonable Function (PUF) and True Random Number Generator (TRNG).
The new BGM240P and MGM240P modules are now available. They have a small form factor of 12.9 mm x 15.0 mm and operate over a range of 1.8 V ~ 3.8 V and -40°C ~ +105°C.
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