Infineon - New 4.5 kV XHP 3 IGBT Module Enables Drive Size Miniaturization and Efficiency

There is a clear trend toward smaller IGBT modules for many applications, as well as a shift of complex designs up the chain. In response to the global trend toward miniaturization and integration, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) has launched the 4.5 kV XHP? 3 IGBT module, which is designed to radically change the landscape for medium voltage drives (MVD) and transportation applications with two- and three-level topologies and using AC voltages of 2,000 V to 3,300 V.

The module has been designed to meet the needs of the industry and to meet the demands of the market. Transportation applications. The new semiconductor device will benefit a wide range of applications including large conveyor belts, pumps, high-speed trains, locomotives, and commercial, construction and agricultural vehicles (CAVs).

XHP3_IGBT　

The XHP series consists of a TRENCHSTOP? IGBT 4450 A half-bridge IGBT module with an emitter-controlled renewal diode and a 450 A diode half-bridge module with an emitter-controlled E4 diode. The insulation voltage of both modules has been increased to 10.4 kV. This pairing helps to simplify paralleling and reduce size without sacrificing efficiency. Previously, paralleling switching modules required complex busbars, which complicated design work and increased inductance. the XHP series utilizes an innovative design that simplifies paralleling by placing the modules side-by-side, which also allows the modules to be paralleled with a single DC busbar.　

　The 4.5 kV XHP series also enables developers to reduce the number of components used during the design process. While traditional IGBT solutions for 3-level solutions have multiple single IGBT switches and a half-bridge diode, designs using the new devices require only two half-bridge switches and a smaller half-bridge diode, which is a significant advancement in drive integration.　

The combination of the FF450R45T3E4_B5 dual switch and the DD450S45T3E4_B5 dual diode provides significant cost savings and reduces the board footprint. For example, Infineon's previous IGBT solutions required four 140 x 190 mm2 or 140 x 130 mm2 switches and a 140 x 130 mm2 double diode. The new XHP series reduces the number of required components to two 140 x 100 mm2 dual switches and a smaller 140 x 100 mm2 dual diode.

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